Thin-film stress control is one of the important steps of production. Elevated temperatures are required to deposit thin-films onto surfaces like wafer. After the application process is done, the base cools down to room temperature. Thermal differences between the film and the wafer can cause stress. The effect of stress can cause the wafer to bow, cracks, film lifting, etc. Thus, it is very important to use advanced tools for thin-film measurement.
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